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Date: 9-February -2010

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Memory Solutions

Mosaic design and manufacture memory solutions for a range of commercial and military applications. We provide a range of innovative, very high density, high speed, wide data width memory products.

Our Engineering team has extensive experience of design, packaging and test of memory products. Our standard product range, for both commercial and military markets, is the result of identification of common customer needs and innovative application of the latest technology to provide solutions.

We have developed a range of core technologies for commercial products including, double sided, high density J lead modules, double sided Chip on Board, Chip Size Package and BGA. Our Engineers are always prepared to discuss the application of these technologies to produce products to fit precise customer requirements. New processes and techniques are under constant evaluation by our design and development team to ensure that the latest materials and techniques are always available to the benefit of our customers.

Mosaic is part of the Apta Group of companies. The group produce a extensive range of semiconductor devices to support commercial and military customers on a worldwide basis.


512K x 8 3.3V Fast SRAM CSP

What's New

Review Data Now

A 512K x 8 SRAM in very high density Chip Size Package is now available from Mosaic. Available in a 10 x 8mm 48 ball BGA package the 3.3V device is available with access times of 15 and 20ns

Review Data Now

Mosaic have introduced a 128MBit 32 bit wide Flash device in standard 84 pin PLCC package. First in a planned range of high density Flash products the 3.3V Vcc device employs a uniform sector architecture.

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Date of Last Update: 6-March -2003

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